G.Beard
New member
Hi.
Just wondering if anyone has explored the possibilities of cured underfill removal, using organic solvents?
I read a post suggesting Dynasolve 225 https://www.dynaloy.com/products/dynasolve-225
I mght give this a shot.
Other suggestions are to heat the chip / PCB area to well above liquidus and twist off the chip. This does not sound too inviting without some expirience of how under chip temps track with measured surface temps, with a thermocouple, on the underside of the board.
Although it does seem to disintegrate nicely with a 380°C iron tip, I'm not sure I want to use up T-30 tips trying to jam them under chips to remove underfill
Anyone else got any suggestions to try out?
How are you removing this crap?
Just wondering if anyone has explored the possibilities of cured underfill removal, using organic solvents?
I read a post suggesting Dynasolve 225 https://www.dynaloy.com/products/dynasolve-225
I mght give this a shot.
Other suggestions are to heat the chip / PCB area to well above liquidus and twist off the chip. This does not sound too inviting without some expirience of how under chip temps track with measured surface temps, with a thermocouple, on the underside of the board.
Although it does seem to disintegrate nicely with a 380°C iron tip, I'm not sure I want to use up T-30 tips trying to jam them under chips to remove underfill
Anyone else got any suggestions to try out?
How are you removing this crap?
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