REBALLING IPHONE ICs USING SOLDER PASTE,(LOOKING FOR TIPS, SUGGESTIONS)

bruce1129

New member
I'm gettn better at reballing iphone ICs but its still taking me too long to do it. Its taking me 2-4 tries to get balls on all the pads using solder paste. im putting the ic flat on the solder mat, then putting the stencil over the top, then adding paste, spreading it around until each hole looks even, then holding it with pressure with tweezers, and hitting it with hot air. then waiting for it to cool before i move the tweezers, but i cant seem to get all the balls on the first try. anyone have any tips, suggestions to make this process a lot faster and less annoying/time consuming
 

jessa

New member
Yes. Stop reballing chips. This is almost always a waste of time and introduces a variable into your troubleshooting making the entire process 2x more complex.
 
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