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Which kind of flux should I use for bga rework, big chip reballing etc? Also what are the ideal temperatures (lead free) to not fry the chips while removing them?
I use NC-559. Temperature I never measure, you can watch when the chip reflows. Temp measurements are always off, so I can tell you that lead-free will reflow at 230C but that does not take into account crappy thermocouples.
and no, it's pointless anyway, I don't want a customer back in my office after a couple of months, I could think about it only maybe for some old iMac but fuck it, I just want to try to reball a personal old hp laptop which has only an affective value (went trough high school with me)