2andrewd
New member
Got around to test driving this one finally, all systems are a go but I get the impression it's not permorming optimally. Originally there were some spi termination components missing, replaced them. Misdiagnosed the U6100 as failing as the board would only turn on after heat was applied to the area (i thought) which lead to
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Replaced U6100 dumping the original, testing a random bin on a NEW mx25l6406d before writing back the original bin... I believe (yupp, im THATguy). It 's running slow it seems but the only error thrown in ASD is Thermal interface TIM test "unknown result code. I've had the heatsink off/on several times each with new compound yet the suggestion is to check that it's properly attached, I don't know what to make of the error.
3 questions:
1) what is the ASD heatsink error implying besides the obvious state of physical attachment?
2) where in ASD is the ME region info listed?
3) was I meant to address a "quad" bit setting (I came across an older post mentioning that new bios chips had to have this configured, i have no idea what it is or if it even applies to this MLB) since the rom was new?
...
Replaced U6100 dumping the original, testing a random bin on a NEW mx25l6406d before writing back the original bin... I believe (yupp, im THATguy). It 's running slow it seems but the only error thrown in ASD is Thermal interface TIM test "unknown result code. I've had the heatsink off/on several times each with new compound yet the suggestion is to check that it's properly attached, I don't know what to make of the error.
3 questions:
1) what is the ASD heatsink error implying besides the obvious state of physical attachment?
2) where in ASD is the ME region info listed?
3) was I meant to address a "quad" bit setting (I came across an older post mentioning that new bios chips had to have this configured, i have no idea what it is or if it even applies to this MLB) since the rom was new?
