Ok. here is an update. I received the new chip and did as you said. I measured around the chip and noted down everything. Then I removed the chip but fucked up during the process. After the removal of the chip, the PP1V05 pads on the board (all 3 of them) were missing. Since they go to the CPU, I guess the mac is dead as long as I won't replace the pads. So this is what I will do next, I think.
So far I only replaced traces on burnt phone boards but never needed to replace BGA pads. Should I just take some replacement pads and glue them onto the board, or is there another better process you recommend? Also, which glue should I use? I would have tried it with UV resin, but I don't know if it will work with sucha small contact area.
So far I only replaced traces on burnt phone boards but never needed to replace BGA pads. Should I just take some replacement pads and glue them onto the board, or is there another better process you recommend? Also, which glue should I use? I would have tried it with UV resin, but I don't know if it will work with sucha small contact area.