Temperature of hot air for soldering/reflow


Hello guys,

I have a hot air station that is capable of supplying hot air up to 500 °C.
What are the recommended temperatures of hot air when replacing IC chips on Macbook boards (for example U7701/LP8550)?
Is the temperature the same when soldering BGA IC or any other component such as resistor or capacitor?

Usually I use 430-450 °C hot air to remove components. Is it better to have higher temperature for short time on the board or vice versa?

Thank you.


Staff member
Each hot air station requires specific settings.
Always better to practice with scrap boards.
The air flow is also important, apart of temperature.

Personally I use Hakko FR-810B with 400/2; rarely use 450/3, when more heat is required.
The nozzle diameter is also important, 8mm in my case.


Thank you 2informaticos. I also have 8 mm nozzle that I used most often. What is 400/2, I guess 400 is 400°C, but what is 2 or 3 in 450/3?


Hello guys, after removal of smd component with hot air, soldering iron is used with fresh solder to prepare pads for new component. I see this on many videos about repairing motherboards. First desoldering wick is used and then new solder is added. What is the temperature set on soldering iron when doing this? I need to be sure not to damage the pad.