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hi,
i have bga like pic but
Especially in the a1466 model, if I try to reball the cpu, the motherboard is warped and when I try to replace the cpu, I notice that half of it does not fit because the card is warped. I need to buy a bga device with IR for this job
Practice with scrap boards.
Try to heat the board from down side more even.
Reported IR temp is much higher than what the board gets from IR heaters.
If you want to get 220 degrees from IR, may need to set to 350, or more; use external thermometer and test with bad boards.
Down hot air heater is closer to the board; it gets more heat from hot air, under CPU.
Also top heater will make the down side getting more temp than expected maybe.
Do not compress the board in the fixture.
Fixing force should go from CPU to board edges.